Providing wireless and embedded solutions.
The SpecTek Wireless/Embedded group recovers and develops wireless and embedded solutions.
We recover Micron silicon fallout in both packaged and die form.
Our current product offerings include eMMC, eMCP, NAND MCP, NOR MCP, NOR, Die, and low power DDR2/DDR3.
Products can be customized and screened based on customer application specifications and requirements.
SpecTek Wireless/Embedded is engaged in technical collaboration with customers to enhance and improve
On this page, you will have an opportunity to review our current product offerings and find opportunities which fit your
design and development goals.
Please review the SpecTek Wireless/Embedded product offerings, and
if you find any products which you might be interested to qualify.
We are ready to work with you through your application qualification process.
· How to use the SpecTek Wireless/Embedded site
- eMMC: 2GB NAND + Controller
- eMCP: 36G NAND + DRAM + Controller
- LPDDR2: 2G & 4G Density
- LPDDR3: 4G Density
- NAND MCP: 2G NAND + 1G LPDRAM, 4G NAND + 2G LPDRAM, 1G NAND + 256M LPDRAM, 1G NAND + 512M LPDRAM, 8G NAND + 4G LPDRAM, 4G NAND + 4G LPDRAM. Our NAND MCP products come in variety of densities and packages.
Contact the SpecTek Wireless/Embedded Group
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